PRODUCT VISUALIZATION · CONFIGURATION MAY VARYStandard + customHigh-throughput interconnect
200G data interface board
A modular data exchange platform for connecting multiple high-throughput acquisition and processing channels.
200Gbps switching bandwidth
01 / TECHNICAL SPECIFICATIONS
The details that guide selection.
| Form factor | 6U VPX rear I/O · 5HP |
|---|---|
| Switching bandwidth | 200 Gbps |
| Protocols | Aurora / UDP |
| Configuration | Channel and network mapping configurable |
Specifications describe reference configurations. Confirm the selected configuration, availability and performance conditions with your quotation.
Download specification summary (CSV) ↓Complete your signal chain.
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